UL Approval: E214381 Version: Prelim 1 12/01/2023 /127/128/130
tec-speed 6.0 H-LF (VT-462SH NF/LF) ultra low loss No Flow and Low Flow product is designed to meet friendly environment requirement. It has good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.
High Speed / ultra low loss
Halogen Free & Lead Free Compatible
Optimized flow range
Pressed Thickness (100% Copper Remain)
* Measured by micrometer “NF” ---- No Flow PP 1) Press Temperature ---- 171˚C 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 22.214.171.124
Thermal Stress @288℃
Dk (RC 60%)
Df (RC 60%)
Breakdown Voltage D48/50 + D0.5/23
Arc Resistance D48/50 + D0.5/23
Peel Strength (1oz Cu)
Peel Strength with CVL
Moisture Absorption after PCT
1 atm., 121˚C, 1 hour
All test data provided are typical values and not intended to be specification values.
Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.