• VT-901PP NF/LF LCTE Polyimide No Flow / Low Flow Prepreg

    UL Approval: E214381 Version: B3 29/09/2023 /40/41/42

    General Information

    Polyimide Low and No Flow product using novel chemistry for flow control and enhanced bond strength designed for use in polyimide rigid-flex applications.

    • Improved for high layer count rigid-flex
    • Tg 200℃
    • Low Z-CTE
    • Meets IPC-4101E Specification sheets /40 /41 & /42
    • Compatible with Lead Free processing
    180507IPCLOGOWEBValidation-listed.jpg (1)

    Storage Condition

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /

    Availability

    Product Type Glass Fabric Resin Content Flow Range * Pressed Thickness
    mil mm mil/ply mm/ply
    VT-901 PP Polyimide Tg 200˚C 106 NF 106 64% 10~50 0.25~1.25 1.8 0.046
    1080 NF 1080 60% 10~50 0.25~1.25 2.8 0.071
    106 LF 106 65% 60~120 1.5~3 1.9 0.048
    106 LF 106 68% 60~120 1.5~3 2.1 0.053
    1080 LF 1080 62% 60~120 1.5~3 3.1 0.079

    Note: * Built on IPC-TM650 2.3.17.2

    Properties Sheet of Pressed No Flow Prepreg

    Test Item Test Method (IPC-TM-650) Unit Typical Value
    Tg TMA 2.4.24 ℃ 200
    Td TGA ASTM D3850 ℃ 390
    Electric Strength 2.5.6.2 KV/mm 54
    Peel Strength with 1oz Cu As Received 2.4.8 Lb/in 8-9
    After Thermal stress 8-9
    Peel Strength with CVL 2.4.8 Lb/in 7
    Moisture Absorption D24/23 2.6.21 % 0.20
    After PCT 1atm., 121℃, 1hour % 0.22
    X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15
    Z-axis CTE Before Tg 2.4.24 ppm/℃ 50
    After Tg ppm/℃ 230
    50~260℃ % 2.5
    Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >300
    Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60
    Arc Resistance D48/50+D0.5/23 2.5.1 Second 150
    Dk (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.8
    Df (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.015
    Flammability As Received UL94 Rating V-0

    All test data provided are typical values and not intended to be specification values.

    Press Condition

    VT-901PP
    Heating rate of materials 2.5-3.5ºC/min (4.5~6.5ºF/min)
    Cure Temperature ≥190ºC
    Cure Time >90min
    Vacuum should be continued until over 140ºC (284ºF) [Material Temperature]
    Pressure on materials: Start with 100psi, Full pressure: 250~450psi
    Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Contact Ventec technical service to discuss the specific condition.

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    Download TDS Datasheet