• VT-901PP 106HW-75/106HW-80 VT-47PP 1080VF-68/106VF-76

    UL Approval: E214381 Version: B4 29/12/2017 /97/98/99/101/126

    General Information

    VT-901PP HW type is a high performance ceramic-filled polyimide prepreg, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The filler in the resin serves to reduce shrinkage and inhibit crack formation during through-hole drilling in filled clearance areas. VT-47PP VF type is a high Tg, lead free compatible and ceramic-filled prepreg, designed for application in filling clearance holes or via holes. The ceramic is filled to minimize resin shrinking and cracking in filled clearance holes.

    Application

    VT-901PP

    • Chip Manufacturers
    • Engine/Flight Controls
    • Power Supply/Backplane
    • Military and Burn-in board

    VT-47PP

    • Automotive under-hood
    • BGA Package
    • High layer
    • Mother board/Backplane

    Storage Condition & Shelf Life

    Shelf life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    The prepreg exceeding shelf life should be retested.

    Availability

    Product Part # Glass Fabric Resin Content Resin Flow Pressed Thickness Equivalent
    VT-901PP 106HW-75 106 75% 45% 2.5mil 84N0675-HF
    106HW-80 106 80% 50% 3.1mil 84N0680-HF
    VT-47PP 1080VF-68 1080 68% 45% 3.3mil /
    106VF-76 106 76% 50% 2.5mil /

    Pressed thickness is measured by micrometer after lamination.

    Properties Sheet

    Property sheet (Test sample information - 2 ply construction)

    Test Item Test Condition Unit VT-47PP VT-901PP
    Tg DSC 2.4.25 °C 180 250
    Td TGA ASTM D3850 °C 355 390
    Electric Strength 2.5.6.2 KV/mm 54 54
    Peel Strength (1oz) As Received 2.4.8 Lb/in 7.5-10 6-9
    After Heated 7.5-10 6-9
    Moisture Absorption D-24/23 2.6.21 % 0.10 0.20
    After PCT 1atm.,121˚C,1 hour 0.12 0.22
    Z-axis CTE (RC75%) Before Tg 2.4.24 PPM/°C 55 50
    After Tg 300 240
    50-260˚C % 3.5% 3.2%
    X-Y CTE IPC-TM-650 2.4.24 PPM/°C - 12~15
    Thermal Stress Solder Dip 288˚C 2.4.13.1 Second >300 >300
    Breakdown Voltage D-48/50+ D0.5-23 2.5.6 KV >60 >60
    Arc Resistance D-48/50+ D0.5-23 ASTM D495 Second 147 150
    DK @ 1MHz C-24/23/50 2.5.5.5 - 4.3 4.3
    DF @ 1MHz C-24/23/50 2.5.5.5 - 0.018 0.016

    All test data provided are typical values and not intended to be specification values.

    Pressing Condition

    Item VT-47PP VT-901PP
    Heat Rise of Material 3.0~5.0℃/min (5~10℉/min) 2.5~4.5℃/min (4.5~8℉/min)
    Cure Temperature >=185℃ >=218℃
    Cure Time >60 minutes >200 minutes
    Vacuuming should be continues until over 140℃ (284℉) for material.
    Pressure: Start from 100psi, Full pressure should be 350psi or above.
    Cold Press: Water cooling at 100psi for more than 60 minutes.

    Contact Ventec technical service to discuss the specific condition.

    Download TDS Datasheet