• VT-447 Laminate/Prepreg

    UL Approval: E214381 Version: B6 28/12/2017 /127/128/130

    General Information

    • Halogen free & High Tg (175℃) FR4.1
    • CAF Resistance
    • Low Z-CTE
    • Excellent Thermal Reliability

    Application

    Mobile Phone, Smart Phone, Computer, Communication Equipment, Instrumentation, Electronic Game Machine, VCR, etc.

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067, etc

    Note: For cores ≤ 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /127 /128 /130

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C - -
    TMA IPC-TM-650 2.4.24 °C 170 minimum 175
    Td ASTM D3850 °C 340 minimum 385
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 40
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 210
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 2.2
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 5.4 maximum 4.35
    DF @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.013
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second - 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 7~9 (1.2~1.6)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 7~9 (1.2~1.6)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 58 (400)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.18
    Flammability UL-94 Rating V0 minimum V0

    All test data provided are typical values and are not intended to be specification values.

    Published on: 28/12/2017

    Download TDS Datasheet
  • VT-447 CCL/Laminate VT-447 PP/Prepreg

    UL Approval: E214381 Version: Rev. B4 28/06/2018 /127/128/130

    Storage Condition & Shelf Life

    Shelf life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 45% 7.60 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    1506 52% 7.00 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015 Standard
    2116 58% 5.30 3.96 3.91 3.86 3.86 0.014 0.015 0.015 0.016 Standard
    2116 54% 4.80 4.07 4.02 3.97 3.97 0.014 0.015 0.015 0.016 Standard
    2116 52% 4.60 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015 Standard
    2113 57% 3.90 3.99 3.94 3.89 3.89 0.014 0.015 0.015 0.016 Standard
    1080 68% 3.30 3.80 3.70 3.65 3.65 0.015 0.016 0.016 0.017 Standard
    1080 66% 3.10 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017 Standard
    1078 68% 3.30 3.80 3.70 3.65 3.65 0.015 0.016 0.016 0.017 Standard
    106 76% 2.30 3.62 3.52 3.47 3.47 0.016 0.017 0.017 0.018 Standard

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

    Laminate Availability

    Core thk. (Inches) Stack-up Resin Content DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-106 72% 3.70 3.60 3.55 3.55 0.016 0.017 0.017 0.018 Standard
    0.003 1-1080 66% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017 Standard
    0.004 1-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.004 2-106 72% 3.70 3.60 3.55 3.55 0.016 0.017 0.017 0.018 2ply
    0.005 1-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016 Standard
    0.006 1-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    0.007 1-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.008 1-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.008 2-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 2ply
    0.010 2-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016 Standard
    0.012 2-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    0.014 2-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.016 2-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.028 4-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.036 5-7628 43% 4.41 4.36 4.31 4.31 0.012 0.013 0.013 0.014 Standard
    0.045 6-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.049 7-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.059 8-7628 44% 4.38 4.33 4.28 4.28 0.012 0.013 0.013 0.014 Standard

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature]
    Programmable Press: 1.5-3.0℃/min (3~5℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

    2. Curing Temperature & Time: >60min at more than 185℃ (365℉)[Material Temperature], maximum temperature should exceed 195℃ (383℉)

    3. Full Pressure: ≥350psi (25Kg/cm2) should be applied in 15~20 minutes after press starts

    4. Vacuuming should be continued until over 140℃ (284℉) [Material Temperature]  

    5. Cold Press condition: Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

    VT-447 PC-1.png VT-447 PC-2.png VT-447 PC-Adara.png

    Typical Drilling Parameters (φ0.3-1.0 mm)

    Desmearing Process

    1. Desmear rate of VT-447 is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations.
    Download PGL Datasheet