Ventec High Performance IMS Dielectric Material Receives UL-Authorization

We are pleased to announce that UL's evaluation of our high-performance ceramic-filled, non-reinforced IMS dielectric material has received authorization to apply the UL mark and has thus been recognized for achieving 155^oC Maximum Operating Temperature (MOT) for electric and mechanical RTI (Relative Temperature Index).

UL's investigation of Ventec's VT-4B5H metal base laminate has been completed and was determined to comply with the applicable requirements including 155^oC MOT (Maximum Operating Temperature) for electric and mechanical RTI (Relative Temperature Index). With thermal conductivity of 4.2 W/m*K and glass transition temperature (Tg) of 180^oC, the versatile IMS material is the perfect choice for use in extreme high temperature applications. These include DC/DC power modules, IGBT applications, motor controllers, high lumen output LED devices, battery charging, OBC chargers for EV vehicles and several other automotive "underhood" applications. VT-4B5H is also highly recommended for chip on board (COB) or direct die in both power and LED applications.

VT-4B5H is available in a wide range of dielectric-, copper foil- and base plate thicknesses and types as well as in numerous panel size options. This versatility is ideal for both single layer and multiple layer IMS designs.

Chris Hanson, Global Head IMS Technology, commented: "Achieving UL authorization for VT-4B5H's industry-leading 155^oC MOT performance is fantastic news. As a complement to our full VT-4B series of superior thermal dissipation materials, our customers have access to an IMS material that meets virtually any high thermal performance requirements."