07 June 2017
UL's investigation of our VT-B series IMS products (VT-4B, VT-4B PP, VT-4B RCC, VT-4B 3S) has been completed and the products were determined to comply with the applicable requirements for the addition of an alternative copper base for the existing metal base laminate grade. The extension of UL-approval for products using copper heat-sink substrates as an alternative to aluminum, expands Ventec's IMS offering for high-end, high-performance applications, in particular for automotive customers.
Mark Goodwin, COO Europe & USA, commented: "We're working closely with the engineering teams at suppliers of LED lighting, e-motors and DC power converters to the automotive business who require thinner dielectrics and higher thermal conductivity. The benefit of copper over aluminum is that it has significantly better thermal conductivity than aluminum, which in certain applications can more than compensate for weight and cost disadvantages and give better performance as an overall package."
About UL
UL fosters safe living and working conditions for people everywhere through the application of science to solve safety, security and sustainability challenges. The UL Mark engenders trust enabling the safe adoption of innovative new products and technologies. Everyone at UL shares a passion to make the world a safer place. We test, inspect, audit, certify, validate, verify, advise and train and we support these efforts with software solutions for safety and sustainability. To learn more about us, visit www.ul.com.
粤公网安备 32050502000822号