VT-464 G Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025 /130

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 6 hours.

 

Prepreg Availability

E-Glass styles: 2116, 3313, 1078, 1067 ,etc.

Delivered Thickness (Inches) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 1067 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
0.0023 1067 70% 3.52 3.48 3.42 3.35 3.28 0.0028 0.0032 0.0036 0.0045 0.0049
0.0025 1067 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
0.003 1078 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
0.0035 1078 69% 3.56 3.52 3.45 3.38 3.31 0.0029 0.0032 0.0037 0.0046 0.0051
0.0045 3313 60% 3.74 3.69 3.62 3.55 3.48 0.003 0.0034 0.0039 0.0049 0.0054
0.005 2116 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 1067 1 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
0.0025 1067 1 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
0.003 1078 1 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
0.004 3313 1 57% 3.79 3.74 3.67 3.6 3.53 0.0031 0.0035 0.004 0.005 0.0055
0.004 1067 2 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
0.005 2116 1 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
0.005 1067 2 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
0.006 1078 2 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
0.008 3313 2 57% 3.79 3.74 3.67 3.6 3.53 0.0031 0.0035 0.004 0.005 0.0055
0.01 2116 2 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
0.015 2116 3 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
0.02 2116 4 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
0.025 2116 5 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
0.03 2116 6 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055

More types could be available upon request.

Press Condition

1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

2. Curing Temperature & Time: >90min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed

 

250203 VT-464G PRESS CONDITION.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

 

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 145 25 8~13 500
1.0 53 31 30~45 1000

Desmearing Process

1. Before using plasma or desmear, a post baking @150ºC for 120min is preferred. 2. 1 cycle Plasma and 1 cycle desmear is recommended. 3. Typical plasma conditions:

Process Temperature ℃ Gas Mixture Power (W) Duration (min)
Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

Typical Chemical conditions. (Atotech chemical)

Process Temperature ℃ Duration (min)
Sewll 60-70 5-10
Permanganate Oxidizer 70-80 10-15

If use other chemical, please consult the chemical supplier for suggested conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

 

Downloads for tec-speed 5.0 (VT-464G)