VT-464 L Laminate/Prepreg

UL Approval: E214381 Version: 16/05/2025 /130

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
Relative Humidity < 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 6 hours.

 

Prepreg Availability

E-Glass styles: 2116, 2113, 1080, 1067,106, 1037, 1027, etc.

Delivered Thickness (Inches) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.0016 1027 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
0.0018 1027 74% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
0.002 1027 76% 3.35 3.18 3.15 3.10 0.0068 0.0071 0.0076 0.0086
0.002 1027 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
0.0022 1037 74% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
0.0018 106 70% 3.47 3.27 3.24 3.20 0.0065 0.0068 0.0073 0.0083
0.002 106 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
0.0024 106 76% 3.35 3.18 3.15 3.10 0.0068 0.0071 0.0076 0.0086
0.0023 1067 69% 3.48 3.45 3.39 3.30 0.0065 0.0068 0.0073 0.0083
0.0027 1067 73% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
0.0029 1080 64% 3.63 3.60 3.53 3.42 0.0062 0.0065 0.0070 0.0080
0.0031 1080 66% 3.55 3.50 3.44 3.37 0.0063 0.0066 0.0071 0.0081
0.0033 1080 68% 3.48 3.45 3.39 3.30 0.0064 0.0067 0.0072 0.0082
0.0038 2113 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
0.0048 2116 54% 3.87 3.82 3.75 3.68 0.0058 0.0061 0.0067 0.0077
0.0051 2116 56% 3.81 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.002 1067 1 66% 3.55 3.50 3.44 3.37 0.0063 0.0066 0.0071 0.0081
0.0025 1078 1 57% 3.82 3.76 3.72 3.62 0.0059 0.0062 0.0068 0.0078
0.003 1080 1 64% 3.63 3.60 3.53 3.42 0.0062 0.0065 0.0070 0.0080
0.003 2112 1 53% 3.87 3.82 3.75 3.68 0.0057 0.0060 0.0066 0.0076
0.0035 2113 1 52% 3.88 3.83 3.76 3.69 0.0057 0.0060 0.0066 0.0076
0.004 2113 1 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
0.005 2116 2 55% 3.88 3.83 3.76 3.69 0.0058 0.0061 0.0067 0.0077
0.006 2112 2 53% 3.87 3.82 3.75 3.68 0.0057 0.0060 0.0066 0.0076
0.007 2113 2 52% 3.88 3.83 3.76 3.69 0.0057 0.0060 0.0066 0.0076
0.008 2113 2 55% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
0.01 2116 2 55% 3.87 3.82 3.75 3.68 0.0058 0.0061 0.0067 0.0077
0.012 1506 2 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
0.014 7628 2 41% 4.22 4.18 4.12 4.03 0.0051 0.0054 0.0059 0.0069
0.015 7628 2 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
0.016 7628 2 46% 4.07 4.03 3.79 3.88 0.0054 0.0057 0.0062 0.0072
0.021 7628 3 41% 4.22 4.18 4.12 4.03 0.0051 0.0054 0.0059 0.0069
0.022 7628 3 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
0.024 7628 3 46% 4.07 4.03 3.97 3.88 0.0054 0.0057 0.0062 0.0072

More types could be available upon request.

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥2.8℃/min

2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Vacuuming should be continued until over 140℃ [Material Temperature]  

5. Cushion for pressure evenness is needed

250516 VT-464L PGL PRESS CONDITION.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 125 25 10~15 500
1.0 53 31 30~45 1000

Desmearing Process

• Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimens. • 1 cycle Plasma and 1 cycle desmearis recommended. • Typical plasma conditions.

Process Temperature ℃ Gas Mixture Power (W) Duration (min)
Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

Typical Chemical conditions. (Atotech chemical)

Process Temperature ℃ Duration (min)
Sewll 60-70 5-10
Permanganate Oxidizer 70-80 10-15

If use other chemical, please consult the chemical supplier for suggested conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

Downloads for tec-speed 3.0 (VT-464L)