• VT-481 Laminate/Prepreg

    UL Approval: E214381 Version: 19/03/2020 /97/98/99/101

    General Information

    • Mid-Tg FR4.0
    • Phenolic Cure System & Lead Free Compatible
    • Excellent Thermal Reliability
    • Low Z-CTE
    • CAF Resistance
    • UV Blocking

    Application

    Computer, Communication Equipment, Instrumentation, Electronic Game Machine, Automotive, etc

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067, etc

    Note: For cores 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /97 /98 /99 /101

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C 150 minimum 155
    TMA IPC-TM-650 2.4.24 °C - -
    Td ASTM D3850 °C 325 minimum 345
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 5 minimum 25
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 45
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 220
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 2.6
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 5.4 maximum 4.3
    DF @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.015
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 147
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 7.5~10 (1.3~1.75)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 7.5~10 (1.3~1.75)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.50 maximum 0.12
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 19/03/2020

    Download TDS Datasheet

  • VT-481 CCL/Laminate VT-481 PP/Prepreg

    UL Approval: E214381 Version: 12/02/2025 /97/98/99/101

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the pre-preg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is same as Normal FR4 material
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process.
      We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

    PP Type Resin Content Press Thickness (mil) DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 48% 8.0 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    7628 46% 7.6 4.34 4.29 4.24 4.24 0.014 0.014 0.015 0.016 Standard
    1506 52% 7.1 4.21 4.16 4.11 4.11 0.015 0.015 0.016 0.017 Standard
    2116 55% 4.8 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
    2116 52% 4.5 4.21 4.16 4.11 4.11 0.015 0.015 0.016 0.017 Standard
    2113 57% 3.8 4.08 4.03 3.98 3.98 0.016 0.016 0.017 0.018 Standard
    1080 68% 3.3 3.81 3.76 3.71 3.71 0.018 0.018 0.019 0.020 Standard
    1080 66% 3.1 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Standard
    106 76% 2.4 3.55 3.50 3.45 3.45 0.019 0.019 0.020 0.021 Standard

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

    Core thk. (Inches) Stack-up Resin Content DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-1067 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Preferred
    0.002 1-106 72% 3.70 3.65 3.60 3.60 0.018 0.018 0.019 0.020 Standard
    0.003 1-2112 50% 4.23 4.18 4.13 4.13 0.015 0.016 0.016 0.017 Preferred
    0.003 1-1080 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Standard
    0.004 1-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    0.004 2-1067 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 2ply preferred
    0.004 2-106 72% 3.70 3.65 3.60 3.60 0.018 0.018 0.019 0.020 2ply
    0.005 1-2116 55% 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
    0.006 1-1506 45% 4.35 4.30 4.25 4.25 0.014 0.014 0.015 0.016 Standard
    0.007 1-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
    0.008 1-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    0.008 2-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 2ply
    0.010 2-2116 55% 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
    0.012 2-1506 45% 4.35 4.30 4.25 4.25 0.014 0.014 0.015 0.016 Standard
    0.014 2-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
    0.016 2-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    0.018 2-7628 + 1-1080 47% 4.27 4.22 4.17 4.17 0.014 0.014 0.015 0.016 Standard
    0.020 2-7628 + 1-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    0.024 3-7628 42% 4.43 4.36 4.29 4.29 0.014 0.014 0.015 0.016 Standard
    0.028 4-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
    0.036 5-7628 43% 4.41 4.35 4.28 4.28 0.014 0.014 0.015 0.016 Standard
    0.039 5-7628 43% 4.41 4.35 4.28 4.28 0.014 0.014 0.015 0.016 Standard
    0.042 6-7628 42% 4.43 4.36 4.29 4.29 0.014 0.014 0.015 0.016 Standard
    0.045 6-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
    0.049 7-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
    0.059 8-7628 44% 4.38 4.32 4.25 4.25 0.014 0.014 0.015 0.016 Standard

    Press Condition

    1.  Heating rate (Rise of Rate) of material [Material Temperature]:
         Programmable Press: 1.5-3.0ºC/min (3~5ºF/min). Manual Press: 3~6ºC /min (5~10ºF/min)
    2.  Curing Temperature & Time: >60min at more than 180ºC (365ºF); [Material Temperature].
    3.  Full Pressure: ≥250-300psi
    4.  Vacuuming should be continued until over 140ºC (284ºF) [Material Temperature]
    5.  Cold Press condition: Keep Plate @ Room Temperature by water; Pressure:100psi; Keep Time: 60minutes

    481 PC-1.png 481 PC-2.png 481 PC-3.png

    Typical Drilling Parameters

    Hole Size (mm) Spindle Speed (KRPM) Feed Rate (IPM) Retract Rate (IPM) Chip Load (Mil/Rev)
    0.20~0.25 150 110 700 0.73
    0.30~0.35 150 130 700 0.87
    0.40~0.55 120 130 900 1.08
    0.60~0.65 80 80 900 1.00
    0.70~1.00 70 80 900 1.14
    1.10~1.25 60 80 900 1.33
    1.30~1.35 55 80 900 1.45
    1.40~1.45 50 80 600 1.60
    1.50~1.80 45 80 600 1.78
    2.05~3.00 30 80 500 2.67

    The use of undercut drill bits has yielded better quality on smaller holes. Check with you drill bit supplier for more information.

    Desmearing Process

    1. Desmear rate is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations.

    Packaging and Baking Recommendations

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil  vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before use.
    Download PGL Datasheet