31 October 2025
Ventec International Group is pleased to announce that its comprehensive range of prepregs, cores, and bondply materials has been added to the Polar Instruments Speedstack material libraries.
From Speedstack version 25.01 onwards, users of both Speedstack Online and Speedstack On-Premises can now easily select and incorporate Ventec materials directly into their PCB stackup designs.
Supporting Accurate Stackup Design and Communication
Polar’s Speedstack software is widely used by PCB designers and fabricators for defining, documenting, and communicating multilayer stackups. The integration of Ventec materials enhances design accuracy and efficiency by ensuring that digital stackups reflect the real-world materials available from Ventec.
- The update includes:
Ventec prepregs – for superior signal integrity and thermal performance
Ventec cores – providing controlled dielectric properties and reliability
Ventec bondply – ideal for complex multilayer rigid-flex constructions
This collaboration makes it easier than ever for designers to specify Ventec materials, supporting a smoother transition from design through to manufacturing.
-
Available Now
The Ventec material libraries are available immediately to all users of Speedstack version 25.01 and above.
Learn more about Speedstack: www.polarinstruments.com/index
粤公网安备 32050502000822号