Glass Free Materials:
Next-Generation Performance.

Ventec’s pro-bond series marks a significant advancement in dielectric material technology, offering high-performance, glass free laminates engineered for the most demanding electronic & thermal management applications. 

By eliminating woven glass reinforcement, pro-bond eliminates fiber weave effects, delivering superior signal integrity, uniformity, and reliability. 
This innovation is essential for high-speed and high-frequency designs in aerospace, automotive, and next-generation communication systems. 

By eliminating woven glass in thermal-bond, the thermal insulating effect of glass is removed from the dielectric, optimizing thermal performance and heat dissipation in MiB and embedded component multi-layer build up structures and component packaging applications.

 

pro-bond RCC & RCF

Designed for high-speed digital (HSD) and high-frequency (HF) applications, Pro-Bond materials are available in dielectric constants (Dk) from 2.8 to 3.05 and dissipation factors (Df) from 0.0005 to 0.0065. They optimize performance across a broad spectrum of signal speeds and bandwidth requirements.  

Type Product Tg (°C) CTE (ppm/°C) Dk Df
pro-bond 4C VT-646LT RCC 295 15.5 3.05 0.0065
pro-bond 7C & 7F VT-770 RCC & RCF 260 17 2.80 0.0025
pro-bond 7FB VT-770B 260 17.5 2.80 0.0025
pro-bond 8C VT-643H RCC 230 18 2.90 0.0016
pro-bond 8F VT-772+ RCF 260 35 2.80 0.0012
pro-bond 9F VT-648 RCF 230 35 2.80 0.0005
pro-bond 20F VT-8728 RCF 210 65 2.85 & 2.96 0.0020
pro-bond 20FG2 VT-8728G2 RCF 220 33 2.94 0.0011


thermal-bond RCF

Where heat dissipation is a primary constraint, thermal-bond delivers outstanding thermal conductivity of 3.2, 7.0, or 9.0 W/mK - along with a high MOT of 155°C. 

By removing glass reinforcement, a thermal bottleneck, thermal-bond creates a direct thermal path from heat-generating components into heat spreaders, metal cores, or chassis, dramatically improving performance without sacrificing structural integrity. 

Type Product Thermal Conductivity (W/mK) Tg (DMA °C) Td (TGA °C) Dk (@1MHz) Df (@1MHz)
thermal-bond 3.0F VT-4B3H RCF 3.2 180 395 4.8 0.016
thermal-bond 5.0F VT-4B7H RCF 7.0 210 420 4.25 0.0015
thermal-bond 7.0F VT-4BC RCF 9.0 210 400 4.60 0.0015
thermal-bond 7.1F VT-4BC(HT1) RCF 12.0 200 400 4.25 0.0015