29 十一月 2018
We will be showing latest PCB material solutions for 5G, new energy vehicle and mini LED applications on Booth #6J11 at HKPCA, China, scheduled to take place December 5th-7th, 2018 at the Shenzhen Convention & Exhibition Center, China.
Our team of materials experts will present the company’s next generation materials including the latest tec-speed 20.0 high-speed/low-loss material range that combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by 5G applications. Of course, with its full range of tec-speed products offering Df values ranging from 0.003 to 0.009 Ventec offers customers an excellent choice of materials fit for the 5G future of switch-, data center-, server-, storage- and handset-applications.
Automotive and LED lighting and DC power conversion applications will also be a key show highlight featuring the latest advances in high performance IMS materials and thermally conductive prepregs and thin core laminates that deliver an exceptional thermal performance, reliability and quality.
With the rise in new energy vehicles, visitors to the booth will discover the latest developments in Ventec's advanced range of high thermal conductivity-, low-loss-, heavy copper- and black laminates that all are backed by fast availability and efficient delivery through Ventec's fully controlled and managed global supply chain and technical support-network.
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