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腾辉集团总部位于中国苏州,是一家全球领先的高品质覆铜箔基板(Copper Clad Laminate)和半固化片(Prepreg)制造销售商,产品广泛应用于各种印刷线路板(PCB)应用。腾辉拥有完整的独立研发能力并致力于持续改善及研发产品以满足客户需求。

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腾辉集团足迹遍布全球,在亚洲、欧洲及美国都有制造、销售以及服务中心。

腾辉总能提供任何您需要的技术产品与服务!

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21 十月 2019

Productronica 2019: launch of autolam base-materials for Automotive Electronics

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03 九月 2019

High-Speed/High-Frequency & IMS Material Technology at key US-Expos

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29 八月 2019

Ventec Expands Thermal Interface Materials Range

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26 七月 2019

Industry Standards are Often Too Wide to Predict PCB Behavior

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