• VT-4B1 Metal Base Laminate

    UL Approval: E214381 Version: B8 16/06/2020 200515Ventec-tec-thermal-pyramid_REV.png

    General Information

    • Thermal conductivity -- 1.0W/mK
    • Ceramic Filled
    • Halogen Free
    • Flammability UL94 V-0
    • MOT 130℃

    VT-4B1 is available only for volume production programs by arrangement


    • 3D Lighting
    • Tail Light
    • Flex to install

    Laminate Properties

    Item Test Method (IPC-TM-650) Unit Dielectric Thickness
    50μm 100μm
    Thermal Conductivity ISO 22007-2 W/m*K 1.0
    Thermal Impedance ISO 22007-2 ℃*in2/W 0.078 0.116
    Tg DSC 2.4.25 100
    Td TGA ASTM D3850 380
    Thermal Stress Solder Dip @ 288℃ Minute >=5
    Hi-Pot Withstand DC V >600
    Breakdown Voltage AC V 3500 7500
    Dk @ 1MHz C-24/23/50 - 4.8
    Df @ 1MHz C-24/23/50 - 0.016
    Volume Resistance After Moisture MΩ-cm 5.0E+8
    E-24/125 3.0E+7
    Surface Resistance After Moisture 2.0E+7
    E-24/125 5.0E+6
    Peel Strength (1oz) As received 2.4.8 Lb/in 11
    CTI As received ASTM D3638 V 600
    Flammability As received UL94 Rating V-0
    RTI Electric UL 746E 130
    Mechanical UL 746E 130

    (1) All test data provided are typical values and not intended to be specification values. (2) Hi-Pot proof test (600VDC) is performed 100% on the whole working panels (with copper foil). Any higher requirement of Hi-Pot test can be AABUS. (3) Breakdown test is a destructive test, which is done on substrate (without copper foil) of a random sample in the FQC laboratory. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice. VT-4B1 is available only for volume production programmes by arrangement

    Storage Condition & Shelf Life

    Item Laminate
    Storage Condition Temperature Room
    Relative Humidity /
    Shelf Life 24 Months

    Designation of IMS Laminate

    200427Designation graphic.png


    Metal Plate Selection

    Alloy Style Thermal Conductivity (W/mK) Hardness (HV) Tensile Strength (MPa) Density (g/cm3) CTE (ppm/℃) Standard Thickness (mm)
    Aluminum (Al) 5052H32 138 68 215 2.7 23.8 1.0, 1.5
    1060H24 220 32 117 2.7 23.6 0.8, 1.5
    Copper (Cu) C1100 386 95 310 8.9 16.8 1.0, 1.5

    Remark: Additional thicknesses could be available upon request.


    Item Availability
    Dielectric Thickness .002" (50μm), .004" (100μm)
    Standard Size Imperial (inch) 18.11*24.02, 20.08*24.02, 20.98*24.02
    Metric (mm) 460*610, 510*610, 533*610
    Copper weight Hoz, 1oz, 2oz

    Remark: Additional options could be available upon request.

    Surface Finish for Aluminum Plate

    Code Surface Finish
    None Default Brushing
    "A" General Anodizing

    Protective Film for Metal Plate

    Type Material Max Operation Temperature
    Standard PET 170℃
    High Temperature Polyimide 270℃

    Bending Performance

    4B1 bending -1.png

    Back Side Milling (Dielectric in tension)


    Direct Rolling (Dielectric in tension)

    200514Direct-Rolling.jpg (1)
    Download TDS Datasheet