• Laminate/Prepreg

    UL Approval: E214381 Version: Preliminary 1 12/09/2017

    General Information

    Ventec offers a series of Ceramic Filled thermally conductive Laminate and Prepreg for multilayer PCB application which desires for thermal dissipation. Laminate and Prepreg provide ease of manufacture during ply-up. The Prepreg provides higher thermal conductivity and flowability, which suits for high power and heavy copper designs.

    • Thermal conductivity - 2.2W/mK, 8 times that of FR4
    • Tg 130℃ & Td 380℃
    • Excellent thermal and insulation performance
    • MOT 105℃
    • Lead-free assembly compatible
    • ROHS & WEEE compliant

    Application

    • Power Conversion
    • PDP, LED, Regulator for TV, Monitor Drives
    • Rectifier, Power supply
    • Automotive Electronics
    • Hybrid Multilayers Constructions
    • Other designs with thermal management requirement

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months

    The Prepreg exceeding shelf life should be retested.

    Laminate Properties

    Properties Sheet

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg IPC-TM-650 2.4.25 °C 90 minimum 130
    Td ASTM D3850 °C - 380
    T260 IPC-TM-650 2.4.24.1 Minute - >60
    T288 IPC-TM-650 2.4.24.1 Minute - >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second 10 minimum >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C - 28
    After Tg IPC-TM-650 2.4.24 ppm/°C - 145
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % - 2.3
    MOT UL 746B °C - 105
    Electrical Properties
    Dielectric Constant @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 7 maximum 5.1
    Dissipation Factor @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.014
    Volume Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 MΩ-cm - 5.1E+8
    E-24/125 IPC-TM-650 2.4.17.1 MΩ-cm 1.0E+4 minimum 3.1E+7
    Surface Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 - 2.3E+7
    E-24/125 IPC-TM-650 2.4.17.1 - 5.2E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) - >1000 (40)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV - >30
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 0 (600)
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) 12 (2.1)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) 12 (2.1)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.5 maximum 0.12
    Flammability UL-94 Rating - V-0
    Thermal Conductivity Z axis ISO22007-2 W/mK - 2.2
    X,Y axis - 3.4

    Note: All test data provided are typical values and not intended to be specification values.

    Availability

    Laminate

    Item Availability
    Copper Foil Hoz, 1oz, 2oz, 3oz
    Dielectric .003"(80um), .004"(100um), .006"(150um), .008"(200um)
    Standard Size 37"*49", 41"*49", 43"*49", and Panels could be cut from above sizes.

    Prepreg

    Glass Fabric Press Thickness (um)
    106 * 80
    106 125
    106 150

    Remark: 106 * has limited ability of resin filling. Please contact Ventec TS before use.

    Inner Layer

    Item Recommendation
    Surface Preparation Chemical treatment preferred
    D.E.S. Standard process
    Oxide Compatible with most oxide chemicals

    Press Condition

    Item Recommendation
    1. Heating rate (Rise of Rate) on Product 3-6℃/min (5~10℉/min)
    2. Full Pressure on Product ≥400psi in 5~10 minutes after pressing starts
    3. Curing Temperature & Time >50min at more than 170℃ (338℉) on Product
    4. Vacuuming should be continued until over 140℃(284℉) [Material Temperature]
    5. Cold Press condition: Keep Plate cooled by water; Pressure:100psi; Dwell: 60minutes

    Machining & Wet Processes

    Item Recommendation
    Drilling Excessive wear of carbide drill bits. Diamond coated drill bits preferred.
    Desmearing Alkaline permanganate or plasma
    Metallization Compatible with direct deposit or electroless copper processes
    Surface Finish Compatible with OSP, HASL, ENIG, etc. Bake prior to HASL.
    Punching&Routing Aggressive wear of machining tools

    Download TDS Datasheet