• VT-47PP NL/LF

    UL Approval: E214381 Version: B8 25/03/2019 /97/98/99/101/126

    General Information

    A generation of phenolic cured Low and No Flow products using Ventec's VT-47 resin technology with optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes. It has good bonding and thermal performance in heat sink bonding and rigid-flex board applications, and offers controlled flow ranges and constancy through the lamination process.

    • High Tg & High Td
    • Lead Free Compatible
    • IPC-4101E /97 /98 /99 /101 /126

    Storage Condition & Shelf Life

    Shelf life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    The prepreg exceeding shelf life should be retested.

    Availability

    Product Type Glass Type Resin Content Flow Range Pressed Thickness
    (mil) (mm) (mil) (mm)
    VT-47 PP Lead Free, Tg 170℃ 106 NF 106 68% 10~50 0.25~1.25 1.8 0.046
    1080 NF 1080 60% 10~50 0.25~1.25 2.7 0.069
    106 LF 106 72% 60~120 1.5~3 2.0 0.051
    1080 LF 1080 65% 60~120 1.5~3 3.0 0.076

    * Measured by micrometer “NF” ---- No Flow PP, “LF” ---- Low Flow PP 1) Press Temperature ---- 171ºC 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2

    Properties Sheet of Pressed No Flow Prepreg

    Test Item Test Method (IPC-TM-650) Unit VT-47
    Tg TMA 2.4.24 170
    Td TGA ASTM D3850 360
    Electric Strength 2.5.6.2 KV/mm 54
    Peel Strength with 1oz Cu 2.4.8 Lb/in 9-10
    Peel Strength with CVL 2.4.8 Lb/in 6
    Moisture Absorption D24/23 2.6.21 % 0.10
    After PCT 1atm., 121℃, 1hour % 0.12
    X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15
    Z-axis CTE Before Tg 2.4.24 ppm/℃ 70
    After Tg 300
    Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >300
    Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60
    Arc Resistance D48/50+D0.5/23 2.5.1 Second 120
    DK (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.9
    DF (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.017
    Flammability As Received UL94 Rating V0

    All test data provided are typical values and not intended to be specification values.

    Selection Guide

    Press Condition

    VT-47PP
    Heating rate of materials 3.0-5.0ºC/min (5~10ºF/min)
    Cure Temperature ≥185ºC
    Cure Time >60min
    Vacuum should be continued until over 140ºC (284ºF) [Material Temperature]
    Pressure on materials: Start with 100psi, Full pressure: 250~450psi
    Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Contact Ventec technical service to discuss the specific condition.

    NFPP PC.png
    Download TDS Datasheet