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VT-447PP NF/LF
UL Approval: E214381 Version: B1 25/03/2019 /127/128/130General Information
VT-447 No Flow and Low Flow product is designed to meet friendly environment requirement. It has good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.
- High Tg & High Td
- Halogen Free & Lead Free Compatible
- IPC-4101E /127 /128 /130
- Optimized flow range for camera module
Storage Condition & Shelf Life
Shelf life
Prepreg Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Relative Humidity < 55% / Shelf Life 3 Months 6 Months The prepreg exceeding shelf life should be retested.
Availability
Product Type Glass Type Resin Content Flow Range Pressed Thickness (mil) (mm) (mil) (mm) VT-447 PP, Lead free & Environment friendly Tg 170℃ 1027 NF 1027 57% 10~50 0.25~1.25 1.2 0.030 1037 NF 1037 62% 10~50 0.25~1.25 1.6 0.040 1067 NF 1067 64% 10~50 0.25~1.25 2.0 0.050 1067 NF 1067 68% 10~50 0.25~1.25 2.4 0.060 1078 NF 1078 60% 10~50 0.25~1.25 3.1 0.080 1086 NF 1086 62% 10~50 0.25~1.25 3.6 0.090 1067 LF 1067 72% 60~120 1.5~3 2.6 0.066 1078 LF 1078 65% 60~120 1.5~3 3.3 0.084 * Measured by micrometer “NF” ---- No Flow PP, “LF” ---- Low Flow PP 1) Press Temperature ---- 171ºC 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2
Properties Sheet of Pressed No Flow Prepreg
Test Item Test Method (IPC-TM-650) Unit VT-447 Tg TMA 2.4.24 ℃ 170 Td TGA ASTM D3850 ℃ 370 Electric Strength 2.5.6.2 KV/mm 54 Peel Strength with 1oz Cu 2.4.8 Lb/in 8-9 Peel Strength with CVL 2.4.8 Lb/in 7.5 Moisture Absorption D24/23 2.6.21 % 0.10 After PCT 1atm., 121℃, 1hour % 0.12 X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15 Z-axis CTE Before Tg 2.4.24 ppm/℃ 70 After Tg 300 Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >300 Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60 Arc Resistance D48/50+D0.5/23 2.5.1 Second 120 DK (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.9 DF (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.015 Flammability As Received UL94 Rating V0 All test data provided are typical values and not intended to be specification values.
Press Condition
VT-447PP Heating rate of materials 3.0-5.0ºC/min (5~10ºF/min) Cure Temperature ≥185ºC Cure Time >60min Vacuum should be continued until over 140ºC (284ºF) [Material Temperature] Pressure on materials: Start with 100psi, Full pressure: 250~450psi Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes Contact Ventec technical service to discuss the specific condition.
