• VT-447PP NF/LF

    UL Approval: E214381 Version: B1 25/03/2019 /127/128/130

    General Information

    VT-447 No Flow and Low Flow product is designed to meet friendly environment requirement. It has good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.

    • High Tg & High Td
    • Halogen Free & Lead Free Compatible
    • IPC-4101E /127 /128 /130
    • Optimized flow range for camera module

    Storage Condition & Shelf Life

    Shelf life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    The prepreg exceeding shelf life should be retested.

    Availability

    Product Type Glass Type Resin Content Flow Range Pressed Thickness
    (mil) (mm) (mil) (mm)
    VT-447 PP, Lead free & Environment friendly Tg 170℃ 1027 NF 1027 57% 10~50 0.25~1.25 1.2 0.030
    1037 NF 1037 62% 10~50 0.25~1.25 1.6 0.040
    1067 NF 1067 64% 10~50 0.25~1.25 2.0 0.050
    1067 NF 1067 68% 10~50 0.25~1.25 2.4 0.060
    1078 NF 1078 60% 10~50 0.25~1.25 3.1 0.080
    1086 NF 1086 62% 10~50 0.25~1.25 3.6 0.090
    1067 LF 1067 72% 60~120 1.5~3 2.6 0.066
    1078 LF 1078 65% 60~120 1.5~3 3.3 0.084

    * Measured by micrometer “NF” ---- No Flow PP, “LF” ---- Low Flow PP 1) Press Temperature ---- 171ºC 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2

    Properties Sheet of Pressed No Flow Prepreg

    Test Item Test Method (IPC-TM-650) Unit VT-447
    Tg TMA 2.4.24 ℃ 170
    Td TGA ASTM D3850 ℃ 370
    Electric Strength 2.5.6.2 KV/mm 54
    Peel Strength with 1oz Cu 2.4.8 Lb/in 8-9
    Peel Strength with CVL 2.4.8 Lb/in 7.5
    Moisture Absorption D24/23 2.6.21 % 0.10
    After PCT 1atm., 121℃, 1hour % 0.12
    X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15
    Z-axis CTE Before Tg 2.4.24 ppm/℃ 70
    After Tg 300
    Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >300
    Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60
    Arc Resistance D48/50+D0.5/23 2.5.1 Second 120
    DK (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.9
    DF (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.015
    Flammability As Received UL-94 Rating V-0

    All test data provided are typical values and not intended to be specification values.

    Press Condition

    VT-447PP
    Heating rate of materials 3.0-5.0ºC/min (5~10ºF/min)
    Cure Temperature ≥185ºC
    Cure Time >60min
    Vacuum should be continued until over 140ºC (284ºF) [Material Temperature]
    Pressure on materials: Start with 100psi, Full pressure: 250~450psi
    Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Contact Ventec technical service to discuss the specific condition.

    NFPP PC.png
    Download TDS Datasheet