• VT-45PP VT-47PP VT-447PP

    UL Approval: E214381 Version: B8 19/04/2018

    General Information

    Ventec provides a series of No Flow and Low Flow Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.

    • VT-45PP High Tg, Low Flow & No Flow, IPC-4101E /21 /24 /26
      A product designed for bonding heat sinks to PCBs, using Ventec’s VT-45 resin technology which has been optimized for processing at reduced temperature & pressure to protect previously mounted components on part processed assemblies.
    • VT-47PP Lead Free High Tg, Low Flow & No Flow, IPC-4101E /97 /98 /99 /101 /126
      A generation of phenolic cured Low and No Flow products using Ventec’s VT-47 resin technology with optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes.
    • VT-447PP High Tg, Lead Free Low Flow & No Flow, IPC-4101E /127 /128 /130
      VT-447 No Flow and Low Flow product is designed to meet friendly environment requirement. It has better bonding ability and could be used for lead free application, specifically designed for use in rigid-flex applications.

    Storage Condition & Shelf Life

    Shelf life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    The prepreg exceeding shelf life should be retested.

    Availability

    Product Type Glass Type Resin Content Flow Range Pressed Thickness
    (mil) (mm) (mil) (mm)
    VT-45 PP Dicy Cured, Tg 170℃ 106 NF 106 66% 10~50 0.25~1.25 1.8 0.046
    1080 NF 1080 60% 10~50 0.25~1.25 2.8 0.071
    106 LF 106 67% 60~120 1.5~3 1.8 0.046
    106 LF 106 72% 60~120 1.5~3 2.1 0.053
    1080 LF 1080 65% 60~120 1.5~3 3.1 0.079
    VT-47 PP Lead Free, Tg 170℃ 106 NF 106 68% 10~50 0.25~1.25 1.8 0.046
    1080 NF 1080 60% 10~50 0.25~1.25 2.7 0.069
    106 LF 106 72% 60~120 1.5~3 2.0 0.051
    1080 LF 1080 65% 60~120 1.5~3 3.0 0.076
    VT-447 PP, Lead free & Environment friendly Tg 170℃ 1027 NF 1027 57% 10~30 0.25~0.75 1.2 0.030
    1037 NF 1037 62% 10-30 0.25~0.75 1.6 0.040
    1067 NF 1067 64% 10~30 0.25~0.75 2.0 0.050
    1067 NF 1067 68% 10~30 0.25~0.75 2.4 0.060
    1078 NF 1078 60% 10~30 0.25~0.75 3.1 0.080
    1067 LF 1067 72% 60~120 1.5~3 2.6 0.066
    1078 LF 1078 65% 60~120 1.5~3 3.3 0.084

    * Measured by micrometer “NF” ---- No Flow PP, “LF” ---- Low Flow PP 1) Press Temperature ---- 171ºC 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2

    Properties Sheet of Pressed No Flow Prepreg

    Test Item Test Method (IPC-TM-650) Unit VT-45 VT-47 VT-447
    Tg TMA 2.4.24 170 170 170
    Td TGA ASTM D3850 320 360 370
    Electric Strength 2.5.6.2 KV/mm 54 54 54
    Peel Strength with 1oz Cu 2.4.8 Lb/in 10-12 9-10 8-9
    Peel Strength with CVL 2.4.8 Lb/in 8 6 7.5
    Moisture Absorption D24/23 2.6.21 % 0.12 0.10 0.10
    After PCT 1atm., 121℃, 1hour % 0.15 0.12 0.12
    X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15 12~15 12~15
    Z-axis CTE Before Tg 2.4.24 ppm/℃ 70 70 70
    After Tg 330 300 300
    Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >100 >300 >300
    Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60 >60 >60
    Arc Resistance D48/50+D0.5/23 2.5.1 Second 120 120 120
    DK (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.9 3.9 3.9
    DF (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.017 0.017 0.015
    Flammability As Received UL94 Rating V0 V0 V0

    All test data provided are typical values and not intended to be specification values.

    Selection Guide

    For Heat Sink Bonding

     

    For Rigid Flex Application

    Press Condition

    VT-45PP VT-47PP VT-447PP
    Heating rate of materials 3.0-5.0ºC/min (5~10ºF/min) 3.0-5.0ºC/min (5~10ºF/min) 3.0-5.0ºC/min (5~10ºF/min)
    Cure Temperature ≥180ºC ≥185ºC ≥185ºC
    Cure Time >50min >60min >60min
    Vacuum should be continued until over 140ºC (284ºF) [Material Temperature]
    Pressure on materials: Start with 100psi, Full pressure: 250~450psi
    Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Contact Ventec technical service to discuss the specific condition.

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    Download TDS Datasheet