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VT-4B1 Metal Base Laminate
UL Approval: E214381 Version: B8 16/06/2020General Information
- Thermal conductivity -- 1.0W/mK
- Ceramic Filled
- Halogen Free
- Flammability UL94 V-0
- MOT 130℃
VT-4B1 is available only for volume production programs by arrangement
Application
- 3D Lighting
- Tail Light
- Flex to install
Laminate Properties
Item Test Method (IPC-TM-650) Unit Dielectric Thickness 50μm 100μm Thermal Conductivity ISO 22007-2 W/m*K 1.0 Thermal Impedance ISO 22007-2 ℃*in2/W 0.078 0.116 Tg DSC 2.4.25 ℃ 100 Td TGA ASTM D3850 ℃ 380 Thermal Stress Solder Dip @ 288℃ 2.4.13.1 Minute >=5 Hi-Pot Withstand DC 2.5.7.2 V >600 Breakdown Voltage AC 2.5.6.3 V 3500 7500 Dk @ 1MHz C-24/23/50 2.5.5.3 - 4.8 Df @ 1MHz C-24/23/50 2.5.5.3 - 0.016 Volume Resistance After Moisture 2.5.17.1 MΩ-cm 5.0E+8 E-24/125 3.0E+7 Surface Resistance After Moisture 2.5.17.1 MΩ 2.0E+7 E-24/125 5.0E+6 Peel Strength (1oz) As received 2.4.8 Lb/in 11 CTI As received ASTM D3638 V 600 Flammability As received UL94 Rating V-0 RTI Electric UL 746E ℃ 130 Mechanical UL 746E ℃ 130 (1) All test data provided are typical values and not intended to be specification values. (2) Hi-Pot proof test (600VDC) is performed 100% on the whole working panels (with copper foil). Any higher requirement of Hi-Pot test can be AABUS. (3) Breakdown test is a destructive test, which is done on substrate (without copper foil) of a random sample in the FQC laboratory. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice. VT-4B1 is available only for volume production programmes by arrangement
Storage Condition & Shelf Life
Item Laminate Storage Condition Temperature Room Relative Humidity / Shelf Life 24 Months Designation of IMS Laminate
Availability
Metal Plate Selection
Alloy Style Thermal Conductivity (W/mK) Hardness (HV) Tensile Strength (MPa) Density (g/cm3) CTE (ppm/℃) Standard Thickness (mm) Aluminum (Al) 5052H32 138 68 215 2.7 23.8 1.0, 1.5 1060H24 220 32 117 2.7 23.6 0.8, 1.5 Copper (Cu) C1100 386 95 310 8.9 16.8 1.0, 1.5 Remark: Additional thicknesses could be available upon request.
Laminate
Item Availability Dielectric Thickness .002" (50μm), .004" (100μm) Standard Size Imperial (inch) 18.11*24.02, 20.08*24.02, 20.98*24.02 Metric (mm) 460*610, 510*610, 533*610 Copper weight Hoz, 1oz, 2oz Remark: Additional options could be available upon request.
Surface Finish for Aluminum Plate
Code Surface Finish None Default Brushing "A" General Anodizing Protective Film for Metal Plate
Type Material Max Operation Temperature Standard PET 170℃ High Temperature Polyimide 270℃ Bending Performance
Back Side Milling (Dielectric in tension)
Direct Rolling (Dielectric in tension)