Option Technologies – a Ventec International Group Brand
Option Technologies is a long established masslam service provider that began trading in 1985. Acquired by Ventec in 2012 and incorporating offshore manufacturing capability, Ventec continues to offer masslam, 'masslam & drill', and 'masslam, drill & plate' solutions to our customers supplied under the Option brand name, which is recognized for technology, quality & service - if your requirements are for technology, quick-turn or simply capacity issues, then we can help. We supply mass-laminated multilayer panels to PCB manufacturers all over the world utilizing high quality laminates & prepregs manufactured by our parent company Ventec International Group. We have mass lamination, drilling & plating capacity in China, with logistics, engineering, technical & quality support based in our customer service centers in Europe & USA, allowing us to customize a supply chain optimized to meet your needs for fast deliveries and cost optimization.
Please contact your local Ventec International Group Service Center to discuss your masslam & drill requirements:
| UK | Germany | USA |
| Email: sales@ventec-europe.com | Email: salesde@ventec-europe.com | Email: saleseast@ventec-usa.com |
| Tel: +44 1926-889822 | Tel: +49 6352-753260 | Tel: +1 630-4221627 |
Services
We offer an exclusive masslam & drilling service as detailed below:
- Masslam, standard or express delivery for off-shore volume from China
- Masslam & Drilling combined, standard or express delivery for off-shore volume from China
Products
- Up to 14 layers
- Masslam
- Masslam & Drill
- Masslam, Drill & Plate
Materials
| Standard FR4 | VT-42, VT-42C |
| High Tg | VT-47, VT-447* |
| CAF-Resistant FR4 | VT-481, VT-47, VT-447* |
| FR4 Halogen-Free | VT-441*, VT-447* |
| Polyimide | VT-901*, VT-90H* |
* Non-UL Release
Capabilities
| layers | 4, 6, 8, 10, 12, 14 (layers) |
| Cu | 1/3oz, Hoz, 1oz, 2oz, 3oz |
| maximum panel size | 24" x 30" |
| minimum panel size | 12" x 16" |
| minimum core thickness | 3mil H/H |
| minimum L/S | 3/3 mil |
| minimum thickness of different layers | 11mil (4L), 49mil (12L), 79mil (14L) |
| inter-layer alignment | ±3mil |
| tolerance of forming size | ±1mm |
| warp | ˂0.75% |
| minimum hole size | 0.15mm / 6mil |
| maximum hole size | up to 10mm / 0.254" |
Copper Plating (bonded panels only)
| maximum panel size | 21.97" x 24" |
| minimum panel size | 14.6" x 13" |
| copper thickness | typically 20μ |
| drill aspect ratio | 6:1 |
Working to the guidelines of the IPC specification
