03 九月 2019
We will be showcasing our latest high reliability PCB materials at two key industry trade shows in the US this month. The Ventec US-team will be in Santa Clara (CA) at PCB West on 10 September (Booth #508) and our thermal management & IMS-specialists will be at the Electric & Hybrid Vehicle Technology Expo in Novi (MI) on booth #1351 from 10-12 September.
PCB West, Santa Clara (CA)
Ventec will once again be exhibiting at one of the industry’s most important exhibitions for printed circuit board design, fabrication and assembly in the US. The Ventec US-team will be on booth #508 to present the company’s unique laminate & prepreg capability across a very wide range of applications and budgets - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support.
A key focus will be Ventec’s extended ceramic-filled hydrocarbon thermoset material series tec-speed 20.0. The range combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by 5G applications. The extended tec speed 20.0 range is designed for the world's most demanding high frequency Printed Circuit Board applications and is already proving to be very popular with customers requiring high-performance, reliable and cost-efficient high frequency materials.
Electric & Hybrid Vehicle Technology Expo, Novi (MI)
From 10-12 September, visitors are invited to meet our thermal management & IMS specialists on booth #1351 to discover the latest advances in high performance IMS materials and thermally conductive prepregs & thin core laminates that deliver exceptional thermal performance, reliability and quality.
With the rise in new energy vehicles, automotive manufacturers around the world are already showing a keen interest and relying on Ventec's advanced range of high thermal conductivity-, low-loss-, heavy copper- and black laminates, including:
- VT-4B5 SP, an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed;
- VT-4B5L, a high performance IMS material that offers excellent solder joint reliability and thermal conductivity of 4.0 W/mK.;
- VT-4B5H, a metal base laminate material with high Tg (180oC) and thermal conductivity of 4.2 W/mK., ideally suited for applications such as LED lighting, power conversion, monitor drives and power supply.
- VT-4B7, a high performance IMS Material for applications where maximum thermal conductivity and electrical performance are key. Specified at 7.0 W/mK., VT-4B7 is an affordably priced substrate that competes strongly with direct-bond copper (DBC).
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