electronica 2018 – No more compromises for high frequency PCB materials

We will be launching our extended ceramic-filled hydrocarbon thermoset material series designed for the world's most demanding high frequency Printed Circuit Board applications at this year’s electronica show in Munich. The global Ventec team will also be on hand in Hall A1 at booth #468 to present the company’s unique laminate & prepreg capability across a very wide range of applications and budgets under the theme of ‘No more compromises: Price, Performance and Availability'.

From 13-16 November, electronica 2018 will be the global launch platform for Ventec's extended tec-speed 20.0 range of ceramic-filled hydrocarbon thermoset material series. Combining unrivalled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec's fully controlled and managed global supply chain and technical support-network, the tec-speed 20.0 series offers excellent dimensional stability and uniform mechanical properties that help limit PIM. With the extended tec-speed 20.0 range, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.

Other show-highlights include:

Material Showcase
A special product & material showcase will demonstrate PCB material applications including a power module and a LED lighting module that illustrates examples of IMS boards combined with FR4 control boards made with Ventec’s high performance and highly reliable IMS materials like VT-4B5SP, VT-4B5L and VT-4B7. Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.

Announcing European distribution agreement for Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, Ventec has teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) to the European market. TIM is a thermally conductive medium used to fill the air gaps between mating surfaces in electronic components. Air is a poor conductor of heat and creates a thermal barrier which stops the transfer of heat between the component and its heatsink or chassis. EMI Thermal’s range of materials distributed through Ventec includes double sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.
With a one-stop-service solution for customers, Ventec also offers further distribution products to the European PCB and electronics industry including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and speciality (Centrum & Glossback) drill materials, copper foils including ACF.

Stock-exchange Listing Celebration
Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. To celebrate the successful IPO as well as the launch of its latest product offerings, Ventec is looking forward to hosting show-visitors at its booth party on Wednesday, 14th November from 18:00 to 21:30.