14 二月 2018
eBook launch: "The Printed Circuit Designer's Guide to...™ Thermal Management with Insulated Metal Substrates"
"The Printed Circuit Designer's Guide to...™ Thermal Management with Insulated Metal Substrates" has been launched. Authored by Ventec’s Didier Mauve and Ian Mayoh, this latest eBook in the iConnect007-series, provides the PCB designer with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate (IMS) laminates, in order to select and specify the most appropriate material for a particular thermal management application, and to achieve a reliable and cost-effective design.
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