31 八月 2017
We'll be showcasing our extensive range of thermal management solutions at the Electric & Hybrid Vehicle Technology Expo on booth #900, including the latest advanced material for thermally conductive cores and prepregs for multi-layer and hybrid build ups. The expo will take place September 12-14, 2017 in Detroit, Michigan.
Our team of materials experts will present the company's advances in high performance IMS materials that deliver an exceptional thermal performance, reliability and quality, particularly demanded by automotive and other LED lighting and DC power conversion applications.
A show-highlight will be VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. It is designed for the world's most thermally demanding PCB applications such as power converters, hybrid multilayers and high-power electronics with heavy copper designs providing enhanced signal stability in harsh environments. With a thermal conductivity 8 times that of FR4, VT-5A2 delivers class-leading thermal performance and high flowability for perfect encapsulation, allowing for better board design for applications requiring critical thermal management in harsh environments. It is manufactured by Ventec using strict quality controlled processes that are certified to AS9100 Revision C, ISO/TS16949 and ISO 9001:2015.
Jack Pattie, President Ventec USA comments: 'As a forum for electric, hybrid and plugin hybrid vehicle technology, the Electric & Hybrid Vehicle Technology Expo will provide visitors with a unique showcase of manufacturing solutions. E-vehicles and hybrid vehicles are a huge business for us and we expect there to be a lot of interest in our solutions, particularly our new products like VT-5A2.'
For more information about the show go to: www.evtechexpo.com
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